Product Category
Serving specialized market segments:
Automotive
Storage Device
Consumer
Communication
Ind. Equipments
DRAM Modules
Optical
Process Capabilities
PCBA Process
SMT Technology Capabilities
| Component | Type |
|---|---|
| Chip | 0201 (Metric) |
| Odd shape | CSP |
| QFP | |
| SOP | |
| BGA | |
| POP | |
| Connector | |
| MTCP | |
| HIC | |
| Transformer |
Total Solution
| Mechanical Parts |
| Final Assemblies |
| Function and Testing |
| Retail Fulfilments |
Component Underfill
Corner Bonding
Spot Welding / Laser Welding
Facilities
Manufacturing Facilities
Solder Paste Printer
Glue Dispenser machine
Panasonic Chip Mounter (NPM DX)
Reflow Oven (Rehm)
Conformal Coating
Spot Welding / Laser Welding
PCB Router
Vapor Soldering
Panasonic Chip Mounter (CM602)
Reflow Oven (BTU)
Panasonic IC Mounter
Selective Soldering
Inspection and Measurement Facilities
3D AOI
3D SPI
CMM
X-Ray Machine
XRF
Viscometer
Digital Microscope
Lead Scan Machine
Temperature Chamber
Cross Section
Dye and Pry
Other Facilities
